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Technical parameters

Environment and package
Flash Size-
Operating Temperature0°C~100°C(TJ)
PackageBulk
Package / Case676-BBGA, FCBGA
RAM Size256KB
Supplier Device Package676-FCBGA (27x27)
Other
ArchitectureMCU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
MfrAMD Xilinx
Number of I/O130
PeripheralsDMA
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Product StatusObsolete
SeriesZynq®-7000
Speed1GHz

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