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  • SYS-F335BGE

    DSP (Digital Signal Processors)

    高性能 32 位自主内核浮点 DSP，工作频率可达 150MHz，集成多种控制外设和通信接口，封装类 型为 BGA176，封装尺寸为 15*15mm，工作温度范 围为 -40℃ ~125℃。

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